JB-100 Wafer Photolithography Machine for for University Microelectronics Fabrication Lab

Product Overview

The JB-100 Photolithography Machine is a core exposure equipment for university microelectronics wafer fabrication training lines — it realizes pattern exposure on photoresist-coated wafers via contact alignment, with high-precision positioning and stable light output to match academic teaching & 1μm process lab prototyping.

Key Specifications

• Specification Item	Details
  Model Number	JB-100
  Application	Pattern exposure for photoresist-coated wafers (university microelectronics wafer fabrication line)
  Applicable Wafer Size	MAX 4" (100mm) / MAX 5" (125mm×125mm)
  Worktable Stroke	X: ±5mm; Y: ±5mm; Z: 3mm; θ: ±12°
  Wafer & Mask Alignment Gap	0~0.05mm
  Alignment Precision	±1μm (for 4" wafers, thickness ≤1μm)
  Exposure Light Source	UVLED (intensity: 40mW/cm²)
  Exposure Uniformity	≤3%
  Exposure Time	0-999s (adjustable)
  Power Input	AC220V / 1000W
  Machine Dimensions (L×W×H)	740mm × 630mm × 1300mm
  Machine Weight	350KG

Advantages for University Labs

• Matching 1μm Wafer Process Training Supports ≤1μm thickness wafers & 1μm alignment precision, perfectly fits the teaching demand of university microelectronics 1μm process fabrication lines

• High-Precision Alignment & Exposure Binocular microscope + multi-axis worktable adjustment ensures accurate pattern transfer; stable UVLED light source guarantees consistent exposure effects

• User-Friendly for Teaching Visual alignment (via microscope) + adjustable parameters (time/uniformity) lower the operation threshold for students, suitable for classroom demonstrations and lab experiments

Package & Service

• Package: 1 set of JB-100 Photolithography Machine (including worktable, light source, and alignment system)

• Service: On-site installation (for production line integration) + operation training (for teachers/students) + 1-year warranty