Bonding Machine for University Turnkey Microelectronics Training Production Line

Product Overview

The JL-100 Ultrasonic Wire Bonder is a critical packaging equipment for university IC (Integrated Circuit) fabrication teaching lines — it performs ultrasonic wire bonding on diced wafers and semiconductor dies, with precise parameter control, visual alignment, and user-friendly operation, tailored for academic teaching, lab training, and microelectronics course experiments.

Key Specifications

• Specification Item	Details
  Model Number	JL-100
  Application	Internal lead bonding for semiconductor devices (wafers, dies, LEDs, power transistors, thick-film ICs) in university IC fabrication teaching line
  Applicable Wire Diameter	18~75μm (1~3mil)
  Ultrasonic Power	0~100% continuously adjustable
  Bonding Time	0~100ms
  Bonding Pressure	20~50g (independently adjustable for first/second bond points)
  Minimum Bonding Pitch	0.28mm (for 1mm span)
  Max Automatic Span	≥6mm (from first to second bond)
  Fixture Movement Range	φ15mm
  Vision System	15~30x binocular microscope
  Power Input	AC220V±10% 50Hz, 60W
  Machine Dimensions (L×W×H)	600mm × 560mm × 380mm
  Machine Weight	~30KG

Advantages for University IC Labs

1. Teaching Process Coverage

Supports the wire bonding step in IC packaging, allowing students to learn the principles of ultrasonic bonding and post-fabrication device assembly in microelectronics courses.

2. Precision & Flexibility

Independent pressure control for two bond points, adjustable ultrasonic power and bonding time, and a high-magnification microscope ensure accurate, repeatable results for teaching experiments.

3. Student-Friendly Operation

Large fixture movement range and automatic span capability simplify setup, while the intuitive control interface lowers the learning curve for student users.

4. Compact & Safe 

Small footprint fits on lab workbenches; reliable grounding and low power consumption meet university lab safety standards.

Package & Service

• Package: 1 set of JL-100 Ultrasonic Wire Bonder (including microscope, bonding head, fixture, and control system)

• Service: On-site installation (integrated into teaching production line) + operation training (for teachers/students) + 1-year warranty