The JS-100 Wet Etching Machine is a core multi-process equipment for university IC (Integrated Circuit) fabrication teaching lines — it integrates developing, cleaning, and etching functions in one unit, designed to handle post-exposure wafer processing. With dedicated functional tanks, corrosion-resistant materials, and full safety protection, it perfectly meets the needs of academic teaching, lab training, and small-batch prototyping for microelectronics majors.
This machine covers 3 critical wet processes in IC wafer fabrication:
1. Developing Process (EPD Tank)
Soak wafers to complete photoresist development; supports manual liquid preparation, waste liquid recovery, and discharge.
Tank material: PVDF (resistant to organic solvents in developing reagents).
2. Cleaning Process (Cleaning Tank)
Rinse wafers with pure water after developing/etching; equipped with a pure water tap and waste water discharge system.
Tank material: PP (corrosion-resistant & easy to clean).
3. Etching Process (Acid Tank)
Soak wafers for material etching; supports immersion heating (30-150℃ temperature control) and waste liquid recovery.
Tank material: PTFE (resistant to strong acids/bases in etching reagents).
1. Teaching Line Compatibility
Integrates 3 core wet processes in one machine, matching the complete wet process section of 1μm IC teaching wafer lines — ideal for students to learn full-process wafer fabrication.
2. Corrosion-Resistant & Durable
Tanks adopt PVDF/PP/PTFE materials (targeted for different reagents), ensuring long-term use in lab environments with various chemical liquids.
3.Full Safety Protection
4 pairs of imported anti-corrosion gloves (isolate operators from reagents).
Automatic liquid level monitoring (prevents overflow).
Top exhaust port (φ200mm) with pressure valve (removes volatile fumes, complying with lab safety standards).
4. User-Friendly for Teaching
Manual liquid preparation & operation (fits student hands-on training).
Dedicated gas/water configuration (1 air gun + 1 water gun + 1 DI tap) for flexible process adjustment.
Specification Item | Details |
Model Number | JS-100 |
Application | Developing, cleaning & etching for post-exposure wafers (university IC fabrication teaching line) |
Functional Tanks | 3 dedicated tanks (EPD tank, cleaning tank, acid tank) |
EPD Tank Features | Soaking, manual liquid preparation, waste liquid recovery/discharge; material: PVDF |
Cleaning Tank Features | Pure water tap, waste water discharge; material: PP |
Acid Tank Features | Soaking, manual liquid preparation, immersion heating (30-150℃), waste liquid recovery/discharge; material: PTFE |
Gas/Water Configuration | 1 air gun + 1 water gun + 1 DI water tap |
Tank Size | 200mm×200mm×200mm |
Waste Liquid Recovery Units | 3 (with automatic liquid level monitoring) |
Safety Protection Accessories | 4 pairs of imported anti-corrosion gloves; top exhaust port (φ200mm, manual pressure valve) |
Power Input | AC380V, 9KW |
Machine Dimensions (L×W×H) | 1900mm × 1150mm × 2025mm |
Machine Weight | 450KG |
Installation: On-site installation & integration into your university’s IC teaching production line.
Training: Free operation training for teachers & students (covers process setup, safety operation, and maintenance).
Warranty: 1-year warranty + lifetime technical support.